Features!Ideally suited for load dump protection!Plastic package has Underwriters LaboratoryFlammability Classification 94V-0! High temperature stability due to unique oxide passiva-tion andpatented PAR®construction!Integrally molded heatsink provides a very low thermalresistance for maximum heat dissipation!Low leakage current at TJ= 175°C!High temperature soldering guaranteed: DO-218AB
0.628(16.0) 0.592(15.0)0.539(13.7) 0.524(13.3)0.116(3.0)0.093(2.4) 260°C for 10 seconds at terminals! Low forward voltage drop0.413(10.5) 0.342(8.7) 0.374(9.5)0.327(8.3)Mechanical Data!Case: DO-218AB
integrally mounted in the encapsulation
!Terminals:Plated, solderable per MIL-STD-750, Method 2026!Polarity: Heatsink is anode!Mounting Position: Any
0.197(5.0) 0.185(4.7)0.366(9.3) 0.343(8.7)0.406(10.3) 0.382(9.7)Dimensions in inches and (millimeters)LEAD 10.138(3.5)0.098(2.5) 0.016 (0.4) Min. 0.028(0.7)0.020(0.5) 0.098(2.5)0.059(1.5) LEAD 2/METAL HEATSINKMaximum RatingsCharacteristic@ TA= 25°C unless otherwise specifiedSymbolPPPMPDIPPMIFSMRθJCTJ, TSTGValue660052008.0See Table 17000.90-55 to +175UnitWWAA°C/W°CPeak pulse power dissipation with 10/1000µs waveform10/10,000µs waveformSteady state power dissipationPeak pulse current with a 10/1000µs waveform(1)Peak forward surge current, 8.3ms single half sine-wave Typical thermal resistance junction to caseOperating junction and storage temperature rangeNotes:(1) Non-repetitive current pulse derated above TA=25°C
BreakdownVoltage
Type
V(BR)(V)
Min.
SM8S20SM8S20A
22.222.2
Max.27.124.5
Test Current
IT(mA)5.05.0
Stand-offVoltageVWM(V)2020
MaximumMaximumMax. PeakReverse ReversePulseLeakageLeakageCurrentat VWMat VWMat 10/1000µs
o
IDTc = 175CWaveform(A)1010
ID(A)150150
(A)184204
Maximum
ClampingVoltage at
IPPMVC(V) 35.832.4
Figure 1- Power Derating Curve
gure 3 -Pulse Waveform
gure 5 -Typical TransientThermal ImpedanceFigure 2-Load DumpPowerCharacteristics
(10 msExponential Waveform)
Figure 4 - Reverse Power Capability
Figure 6 -Typical Junction Capacitance
2 of 3
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