专利名称：Apparatus and method for testing an
electronics package substrate
发明人：Stephen Bradford Gospe申请号：US09059619申请日：19980413公开号：US06335627B1公开日：20020101
专利附图：
摘要：An apparatus for testing an electrical connection between a first electricalcontact on a first side of an electronics package substrate and a first electrical terminalon a second, opposing side of the substrate. A holder is provided which is capable of
releasably receiving and holding a substrate. At least a first electrical pin is located onthe holder. The first electrical pin is positioned to contact the first electrical contact onthe first side of the substrate. A support structure is mounted to the holder. An electricalprobe is mounted to the support structure. The electrical probe is movable relatively tothe support structure between a first position and a second position. In the first positionthe electrical probe is distant from the first electrical terminal on the second side of thesubstrate. In the second position the electrical probe is in contact with the first electricalterminal.
申请人：INTEL CORPORATION
代理机构：Blakely, Sokoloff, Taylor & Zafman LLP
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