MC10LVEP11, MC100LVEP112.5V / 3.3VECL 1:2
Differential Fanout Buffer
Description
The MC10/100LVEP11 is a differential 1:2 fanout buffer. Thedevice is pin and functionally equivalent to the EP11 device. With ACperformance the same as the EP11 device, the LVEP11 is ideal forapplications requiring lower voltage. Single−ended CLK inputoperation is limited to a VCC w 3.0 V in PECL mode, or VEE v−3.0 V in NECL mode.
The 100 Series contains temperature compensation.
Features
81SOIC−8D SUFFIXCASE 751http://onsemi.com
MARKINGDIAGRAMS*8HVP11ALYWG118KVP11ALYWG•240 ps Typical Propagation Delay
•Maximum Frequency > 3.0 GHz Typical
•PECL Mode Operating Range: VCC = 2.375 V to 3.8 V•
with VEE = 0 V
NECL Mode Operating Range: VCC = 0 V with VEE = −2.375 V to −3.8 VOpen Input Default State
81TSSOP−8DT SUFFIXCASE 948R8HU11ALYWGG8KU11ALYWGG•
•Q Output Will Default LOW with Inputs Open or at VEE•LVDS Input Compatible
•Pb−Free Packages are Available
115X MGGDFN8MN SUFFIXCASE 506AAHK5X4K= MC10= MC100= MC10= MC100141A= Assembly LocationL= Wafer LotY= YearW= Work WeekM= Date CodeG= Pb−Free Package(Note: Microdot may be in either location)*For additional marking information, refer to Application Note AND8002/D.ORDERING INFORMATION
See detailed ordering and shipping information in the packagedimensions section on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
December, 2006 − Rev. 11
1
Publication Order Number:
MC10LVEP11/D
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MC10LVEP11, MC100LVEP11
Table 1. PIN DESCRIPTION
Q0
18VCC
D*, D**Q0, Q0, Q1, Q1Q027D
VCCVEEEP
Q1
36DPIN
FUNCTION
ECL Data InputsECL Data OutputsPositive SupplyNegative Supply
Exposed pad must be connected to asufficient thermal conduit. Electricallyconnect to the most negative supply orleave floating open.
*Pins will default to 2/3 VCC when left open.**Pins will default LOW when left open.
Q145VEE
Figure 1. 8−Lead Pinout (Top View) and Logic
Diagram
Table 2. ATTRIBUTES
Characteristics
Internal Input Pulldown ResistorInternal Input Pullup ResistorESD Protection
Human Body Model
Machine Model
Charged Device Model
Value75 kW37.5 kW> 4 kV> 200 V> 2 kVLevel 1
UL 94 V−0 @ 0.125 in
110 Devices
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)Flammability RatingTransistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test1.For additional information, see Application Note AND8003/D.
Oxygen Index: 28 to 34
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MC10LVEP11, MC100LVEP11
Table 3. MAXIMUM RATINGS
SymbolVCCVEEVIIoutTATstgqJAqJCqJAqJCqJATsol
Parameter
PECL Mode Power SupplyNECL Mode Power SupplyPECL Mode Input VoltageNECL Mode Input VoltageOutput Current
Operating Temperature RangeStorage Temperature Range
Thermal Resistance (Junction−to−Ambient)Thermal Resistance (Junction−to−Case)Thermal Resistance (Junction−to−Ambient)Thermal Resistance (Junction−to−Case)Thermal Resistance (Junction−to−Ambient)Wave Solder
PbPb−Free
0 lfpm500 lfpmStandard Board0 lfpm500 lfpmStandard Board0 lfpm500 lfpm
<2 to 3 sec @ 248°C<2 to 3 sec @ 260°C
SOIC−8SOIC−8SOIC−8TSSOP−8TSSOP−8TSSOP−8DFN8DFN8
Condition 1VEE = 0 VVCC = 0 VVEE = 0 VVCC = 0 VContinuousSurge
VI v VCCVI w VEE
Condition 2
Rating6−66−650100−40 to +85−65 to +150
19013041 to 4418514041 to 4412984265265
UnitVVVVmAmA°C°C°C/W°C/W°C/W°C/W°C/W°C/W°C/W°C/W°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above theRecommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affectdevice reliability.
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MC10LVEP11, MC100LVEP11
Table 4. 10LVEP DC CHARACTERISTICS, PECL VCC = 2.5 V, VEE = 0 V (Note 2)
−40°C
SymbolIEEVOHVOLVIHCMR
Characteristic
Power Supply CurrentOutput HIGH Voltage (Note 3)Output LOW Voltage (Note 3)Input HIGH Voltage Common ModeRange (Differential Configuration)(Note 4)
Input HIGH CurrentInput LOW Current
DD0.5−150Min2513655651.2
Typ331490740
Max4016158652.5
Min2914306301.2
25°CTyp331555805
Max4016809302.5
Min3214906901.2
85°CTyp341615865
Max4217409902.5
UnitmAmVmVV
IIHIIL
150
0.5−150
150
0.5−150
150mAmA
NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.
2.Input and output parameters vary 1:1 with VCC. VEE can vary +0.125 V to −1.3 V.3.All loading with 50 W to VCC − 2.0 V.
4.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differentialinput signal. Single−Ended input CLK pin operation is limited to VCC w 3.0 V in PECL mode.
Table 5. 10LVEP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 5)
−40°C
SymbolIEEVOHVOLVIHVILVIHCMR
Characteristic
Power Supply CurrentOutput HIGH Voltage (Note 6)Output LOW Voltage (Note 6)Input HIGH Voltage (Single−Ended)(Note 7)
Input LOW Voltage (Single−Ended)(Note 7)
Input HIGH Voltage Common ModeRange (Differential Configuration)(Note 8)
Input HIGH CurrentInput LOW Current
DD0.5−150Min2521651365209013651.2
Typ3322901540
Max4024151665241516903.3
Min2922301430215514301.2
25°CTyp3323551605
Max4024801730248017553.3
Min3222901490221514901.2
85°CTyp3424151665
Max4225401790254018153.3
UnitmAmVmVmVmVV
IIHIIL
150
0.5−150
150
0.5−150
150mAmA
NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.
5.Input and output parameters vary 1:1 with VCC. VEE can vary +0.925 V to −0.5 V.6.All loading with 50 W to VCC − 2.0 V.
7.Single−Ended input CLK pin operation is limited to VCC w 3.0 V in PECL mode.
8.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differentialinput signal.
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MC10LVEP11, MC100LVEP11
Table 6. 10LVEP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = −3.8 V to −2.375 V (Note 9)
−40°C
SymbolIEEVOHVOLVIHVILVIHCMR
Characteristic
Power Supply Current
Output HIGH Voltage (Note 10)Output LOW Voltage (Note 10)Input HIGH Voltage (Single−Ended)(Note 11)
Input LOW Voltage (Single−Ended)(Note 11)
Input HIGH Voltage Common ModeRange (Differential Configuration)(Note 12)
Input HIGH CurrentInput LOW Current
DD0.5−150Min25−1135−1935−1210−1935VEE+1.2
Typ33−1010−1760
Max40−885−1635−885−16100.0
Min29−1070−1870−1145−1870VEE+1.2
25°CTyp33−945−1695
Max40−820−1570−820−15450.0
Min32−1010−1810−1085−1810VEE+1.2
85°CTyp34−885−1635
Max42−760−1510−760−14850.0
UnitmAmVmVmVmVV
IIHIIL
150
0.5−150
150
0.5−150
150mAmA
NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.
9.Input and output parameters vary 1:1 with VCC.10.All loading with 50 W to VCC − 2.0 V.
11.Single−Ended input CLK pin operation is limited to VEE v −3.0 V in NECL mode.
12.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differentialinput signal.
Table 7. 100LVEP DC CHARACTERISTICS, PECL VCC = 2.5 V, VEE = 0 V (Note 13)
−40°C
SymbolIEEVOHVOLVIHVILVIHCMR
Characteristic
Power Supply Current
Output HIGH Voltage (Note 14)Output LOW Voltage (Note 14)Input HIGH Voltage (Single−Ended)Input LOW Voltage (Single−Ended)Input HIGH Voltage Common ModeRange (Differential Configuration)(Note 15)
Input HIGH CurrentInput LOW Current
DD0.5−150Min25135555513355551.2
Typ351480730
Max42160590016209002.5
Min29135555513355551.2
25°CTyp381480730
Max46160590016209002.5
Min32135555513355551.2
85°CTyp411480730
Max50160590016209002.5
UnitmAmVmVmVmVV
IIHIIL
150
0.5−150
150
0.5−150
150mAmA
NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.
13.Input and output parameters vary 1:1 with VCC. VEE can vary +0.125 V to −1.3 V.14.All loading with 50 W to VCC − 2.0 V.
15.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differentialinput signal. Single−Ended input CLK pin operation is limited to VCC w 3.0 V in PECL mode.
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MC10LVEP11, MC100LVEP11
Table 8. 100LVEP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 16)
−40°C
SymbolIEEVOHVOLVIHVILVIHCMR
Characteristic
Power Supply Current
Output HIGH Voltage (Note 17)Output LOW Voltage (Note 17)Input HIGH Voltage (Single−Ended)(Note 18)
Input LOW Voltage (Single−Ended) (Note 18)
Input HIGH Voltage Common ModeRange (Differential Configuration)(Note 19)
Input HIGH CurrentInput LOW Current
DD0.5−150Min2521551355213513551.2
Typ3522801530
Max4224051700242017003.3
Min2921551355213513551.2
25°CTyp3822801530
Max4624051700242017003.3
Min3221551355213513551.2
85°CTyp4122801530
Max5024051700242017003.3
UnitmAmVmVmVmVV
IIHIIL
150
0.5−150
150
0.5−150
150mAmA
NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.
16.Input and output parameters vary 1:1 with VCC. VEE can vary +0.925 V to −0.5 V.17.All loading with 50 W to VCC − 2.0 V.
18.Single−Ended input CLK pin operation is limited to VCC w 3.0 V in PECL mode.
19.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differentialinput signal.
Table 9. 100LVEP DC CHARACTERISTICS, NECL VCC = 0 V; VEE = −3.8 V to −2.375 V (Note 20)
−40°C
SymbolIEEVOHVOLVIHVILVIHCMR
Characteristic
Power Supply Current
Output HIGH Voltage (Note 21)Output LOW Voltage (Note 21)Input HIGH Voltage (Single−Ended)(Note 22)
Input LOW Voltage (Single−Ended)(Note 22)
Input HIGH Voltage Common ModeRange (Differential Configuration)(Note 23)
Input HIGH CurrentInput LOW Current
DD0.5−150Min25−1145−1945−1165−1945
−1425Typ35−1020−1770
Max42−895−1600−880−16000.0
Min29−1145−1945−1165−1945
−142525°CTyp38−1020−1770
Max46−895−1600−880−16000.0
Min32−1145−1945−1165−1945
−142585°CTyp41−1020−1770
Max50−895−1600−880−16000.0
UnitmAmVmVmVmVV
VEE+1.2VEE+1.2VEE+1.2
IIHIIL
150
0.5−150
150
0.5−150
150mAmA
NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.
20.Input and output parameters vary 1:1 with VCC.21.All loading with 50 W to VCC − 2.0 V.
22.Single−Ended input CLK pin operation is limited to VEE −3.0 V in NECL mode.
23.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differentialinput signal.
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Table 10. AC CHARACTERISTICS VCC = 0 V; VEE = −3.8 V to −2.375 V or VCC = 2.375 V to 3.8 V; VEE = 0 V (Note 24)
−40°C
SymbolfmaxtPLH,tPHLtSKEWtJITTER
Characteristic
Maximum Frequency (Figure 2)Propagation Delay
(Differential Configuration)
CLK to Q, QWithin Device SkewQ, QDevice to Device Skew (Note 25)CLOCK Random Jitter (RMS)@ v1.0 GHz@ v1.5 GHz@ v2.0 GHz@ v2.5 GHz@ v3.0 GHz
Input Voltage Swing
(Differential Configuration)Output Rise/Fall Times(20% − 80%)
Q, Q15070
5.0
201300.30.20.30.20.21200170
15080
5.0
201300.40.30.20.30.31200180
150100
5.0
201500.30.20.30.30.61200200
psps
170Min
Typ3230
300
180
Max
Min
25°CTyp3240
310
210
Max
Min
85°CTyp3270
360Max
UnitGHzps
0.1260.1120.1110.1120.155800110
0.1420.1620.1220.1720.217800120
0.2090.1620.1700.2350.368800140
VPPtrtf
mVps
NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.
24.Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V.25.Skew is measured between outputs under identical transitions.
1000900VOUTpp (mV)80070060050040030020010000
3.3 V2.5 V10002000
FREQUENCY (MHz)
30004000
Figure 2. Fmax Typical
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MC10LVEP11, MC100LVEP11
QDriverDeviceQZo = 50 W50 W50 WDZo = 50 WDReceiverDeviceVTT
VTT = VCC − 2.0 V
Figure 3. Typical Termination for Output Driver and Device Evaluation(See Application Note AND8020/D − Termination of ECL Logic Devices.)
ORDERING INFORMATION
Device
MC10LVEP11DMC10LVEP11DGMC10LVEP11DR2MC10LVEP11DR2GMC10LVEP11DTMC10LVEP11DTGMC10LVEP11DTR2MC10LVEP11DTR2GMC10LVEP11MNR4MC10LVEP11MNR4GMC100LVEP11DMC100LVEP11DGMC100LVEP11DR2MC100LVEP11DR2GMC100LVEP11DTMC100LVEP11DTGMC100LVEP11DTR2MC100LVEP11DTR2GMC100LVEP11MNR4MC100LVEP11MNR4G
PackageSOIC−8SOIC−8(Pb−Free)SOIC−8SOIC−8(Pb−Free)TSSOP−8TSSOP−8(Pb−Free)TSSOP−8TSSOP−8(Pb−Free)DFN8DFN8(Pb−Free)SOIC−8SOIC−8(Pb−Free)SOIC−8SOIC−8(Pb−Free)TSSOP−8TSSOP−8(Pb−Free)TSSOP−8TSSOP−8(Pb−Free)DFN8DFN8(Pb−Free)
Shipping†98 Units / Rail98 Units / Rail2500 / Tape & Reel2500 / Tape & Reel100 Units / Rail100 Units / Rail2500 / Tape & Reel2500 / Tape & Reel1000 / Tape & Reel1000 / Tape & Reel98 Units / Rail98 Units / Rail2500 / Tape & Reel2500 / Tape & Reel100 Units / Rail100 Units / Rail2500 / Tape & Reel2500 / Tape & Reel1000 / Tape & Reel1000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.
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MC10LVEP11, MC100LVEP11
Resource Reference of Application Notes
AN1405/DAN1406/DAN1503/DAN1504/DAN1568/DAN1672/DAND8001/DAND8002/DAND8020/DAND8066/DAND8090/D
−ECL Clock Distribution Techniques−Designing with PECL (ECL at +5.0 V)−ECLinPSt I/O SPiCE Modeling Kit−Metastability and the ECLinPS Family−Interfacing Between LVDS and ECL−The ECL Translator Guide−Odd Number Counters Design−Marking and Date Codes−Termination of ECL Logic Devices−Interfacing with ECLinPS
−AC Characteristics of ECL Devices
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PACKAGE DIMENSIONS
SOIC−8 NBCASE 751−07ISSUE AH
−X−NOTES:
1.DIMENSIONING AND TOLERANCING PERANSI Y14.5M, 1982.
2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSION A AND B DO NOT INCLUDEMOLD PROTRUSION.
4.MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.
5.DIMENSION D DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTALIN EXCESS OF THE D DIMENSION ATMAXIMUM MATERIAL CONDITION.
6.751−01 THRU 751−06 ARE OBSOLETE. NEWSTANDARD IS 751−07.
MILLIMETERSMINMAX4.805.003.804.001.351.750.330.511.27 BSC0.100.250.190.250.401.270 _8 _0.250.505.806.20
INCHES
MINMAX0.1890.1970.1500.1570.0530.0690.0130.0200.050 BSC0.0040.0100.0070.0100.0160.0500 _8 _0.0100.0200.2280.244
A85B1S40.25 (0.010)MYM−Y−GKC−Z−HD0.25 (0.010)
MSEATINGPLANENX 45_0.10 (0.004)MJZY
SX
SDIMABCDGHJKMNS
SOLDERING FOOTPRINT*
1.520.0607.00.2754.00.1550.60.0241.2700.050SCALE 6:1
mmǓǒinches*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.
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MC10LVEP11, MC100LVEP11
PACKAGE DIMENSIONS
TSSOP−8DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
8x REFK0.15 (0.006)TUS2X0.10 (0.004)L/2815MTUSVSLPIN 1IDENT4B−U−0.25 (0.010)M0.15 (0.006)TUSA−V−FDETAIL ENOTES:
1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.
2.CONTROLLING DIMENSION: MILLIMETER.
3.DIMENSION A DOES NOT INCLUDE MOLD FLASH.PROTRUSIONS OR GATE BURRS. MOLD FLASHOR GATE BURRS SHALL NOT EXCEED 0.15(0.006) PER SIDE.
4.DIMENSION B DOES NOT INCLUDE INTERLEADFLASH OR PROTRUSION. INTERLEAD FLASH ORPROTRUSION SHALL NOT EXCEED 0.25 (0.010)PER SIDE.
5.TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.
6.DIMENSION A AND B ARE TO BE DETERMINEDAT DATUM PLANE −W−.
MILLIMETERSMINMAX2.903.102.903.100.801.100.050.150.400.700.65 BSC0.250.404.90 BSC0 6 __INCHESMINMAX0.1140.1220.1140.1220.0310.0430.0020.0060.0160.0280.026 BSC0.0100.0160.193 BSC0 6 __C0.10 (0.004)−T−SEATINGPLANEDGDETAIL E−W−DIMABCDFGKLMhttp://onsemi.com
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MC10LVEP11, MC100LVEP11
PACKAGE DIMENSIONS
DFN8
CASE 506AA−01
ISSUE D
DABPIN ONEREFERENCENOTES:1.DIMENSIONING AND TOLERANCING PERASME Y14.5M, 1994 .2.CONTROLLING DIMENSION: MILLIMETERS.3.DIMENSION b APPLIES TO PLATEDTERMINAL AND IS MEASURED BETWEEN0.25 AND 0.30 MM FROM TERMINAL.4.COPLANARITY APPLIES TO THE EXPOSEDPAD AS WELL AS THE TERMINALS.DIMAA1A3bDD2EE2eKLMILLIMETERSMINMAX0.801.000.000.050.20 REF0.200.302.00 BSC1.101.302.00 BSC0.700.900.50 BSC0.20−−−0.250.35E2 X0.10C2 X0.10CTOP VIEW0.10C8 X
A(A3)Ce18 X40.08CSEATINGPLANEA1SIDE VIEWD2e/2LE2K858 Xb0.10CAB0.05CNOTE 3ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
BOTTOM VIEW
PUBLICATION ORDERING INFORMATION
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