专利名称:WORKPIECE PROCESSOR HAVING
PROCESSING CHAMBER WITH IMPROVEDPROCESSING FLUID FLOW
发明人:WILSON, Gregory, J.,HANSON, Kyle,
M.,MCHUGH, Paul, R.
申请号:EP00922257.1申请日:20000413公开号:EP1194613A1公开日:20020410
摘要:The workpiece setting that process container (610) provides the
microelectronics at least one surface in the treatment fluid of air-flow during Immersiontreatment illustrates. The process container include: principal fluid flow chamber (505) atleast one surface provide treatment fluid stream workpiece and multiple nozzles (535) toprimary fluid flow chamber provide treatment fluid stream principal fluid flow chamber.Multiple nozzles and orientation are set with provide those of vertical and radial fluidflow component in conjunction with and generate substantially homogeneous normaldischarge component radially across the surface of workpiece. Example devices alsoprovide a kind of this process container of use that is, particularly suitable forelectroplating processes are carried out. According to the other aspect of presentdisclosure, a kind of improved fluid removing path (640) is used to fluid handlingmicroelectronic workpiece from during principal fluid flow chamber submergence.
申请人:SEMITOOL, INC.
地址:655 West Reserve Drive Kalispell,Montana 59901 US
国籍:US
代理机构:Hirsch, Peter, Dipl.-Ing.
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