Processing low dielectric constant materials for h

专利名称：Processing low dielectric constant materials

for high speed electronics

发明人：Robert J. Wojnarowski,Herbert S.

Cole,Theresa A. Sitnik-Nieters,WolfgangDaum

申请号：US08/411178申请日：19950327公开号：US05554305A公开日：19960910

摘要：A method for processing a low dielectric constant material includes dispersingan additive material in a porous low dielectric constant layer, fabricating a desiredelectronic structure, and then removing the additive material from the pores of the lowdielectric constant layer. The removal of the additive material from the pores can beaccomplished by sublimation, evaporation, and diffusion. Applications for the lowdielectric constant layer include the use as an overlay layer for interconnecting a circuitchip supported by a substrate and the use as printed circuit board material.

申请人：GENERAL ELECTRIC COMPANY

代理人：Ann M. Agosti,Marvin Snyder

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